Optically oriented attachment of nanoscale metal-semiconductor heterostructures in organic solvents via photonic nanosoldering.

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Title: Optically oriented attachment of nanoscale metal-semiconductor heterostructures in organic solvents via photonic nanosoldering.
Authors: Crane MJ; Department of Chemical Engineering, University of Washington, Seattle, WA, 98195-1750, USA., Pandres EP; Department of Chemical Engineering, University of Washington, Seattle, WA, 98195-1750, USA., Davis EJ; Department of Chemical Engineering, University of Washington, Seattle, WA, 98195-1750, USA., Holmberg VC; Department of Chemical Engineering, University of Washington, Seattle, WA, 98195-1750, USA. holmvc@uw.edu.; Molecular Engineering & Sciences Institute, University of Washington, Seattle, WA, 98195-1652, USA. holmvc@uw.edu.; Clean Energy Institute, University of Washington, Seattle, WA, 98195-1653, USA. holmvc@uw.edu., Pauzauskie PJ; Department of Chemical Engineering, University of Washington, Seattle, WA, 98195-1750, USA. peterpz@uw.edu.; Molecular Engineering & Sciences Institute, University of Washington, Seattle, WA, 98195-1652, USA. peterpz@uw.edu.; Department of Materials Science and Engineering, University of Washington, Seattle, WA, 98195-2120, USA. peterpz@uw.edu.; Institute for Nano-Engineered Systems, University of Washington, Seattle, WA, 98195-1653, USA. peterpz@uw.edu.; Physical and Computational Sciences Directorate, Pacific Northwest National Laboratory, Richland, WA, 99352, USA. peterpz@uw.edu.
Source: Nature communications [Nat Commun] 2019 Oct 30; Vol. 10 (1), pp. 4942. Date of Electronic Publication: 2019 Oct 30.
Publication Type: Journal Article; Research Support, U.S. Gov't, Non-P.H.S.; Research Support, Non-U.S. Gov't
Journal Info: Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE; PubMed not MEDLINE
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  Data: Optically oriented attachment of nanoscale metal-semiconductor heterostructures in organic solvents via photonic nanosoldering.
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  Data: <searchLink fieldCode="JN" term="%22101528555%22">Nature communications</searchLink> [Nat Commun] 2019 Oct 30; Vol. 10 (1), pp. 4942. <i>Date of Electronic Publication: </i>2019 Oct 30.
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