High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films.
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| Title: | High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films. |
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| Authors: | Hoque MSB; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Koh YR; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Braun JL; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Mamun A; Department of Electrical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States., Liu Z; Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States., Huynh K; Department of Materials Science and Engineering, University of California, Los Angeles, California 90095, United States., Liao ME; Department of Materials Science and Engineering, University of California, Los Angeles, California 90095, United States., Hussain K; Department of Electrical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States., Cheng Z; George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Hoglund ER; Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Olson DH; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Tomko JA; Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Aryana K; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Galib R; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Gaskins JT; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Elahi MMM; Department of Electrical and Computer Engineering, University of New Mexico, Albuquerque, New Mexico 87131, United States., Leseman ZC; Department of Mechanical Engineering, and Interdisciplinary Research Center for Advanced Materials, King Fahd University of Petroleum & Minerals, Dhahran, Eastern Province 31261, Saudi Arabia., Howe JM; Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Luo T; Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States., Graham S; George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Goorsky MS; Department of Materials Science and Engineering, University of California, Los Angeles, California 90095, United States., Khan A; Department of Electrical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States., Hopkins PE; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.; Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.; Department of Physics, University of Virginia, Charlottesville, Virginia 22904, United States. |
| Source: | ACS nano [ACS Nano] 2021 Jun 22; Vol. 15 (6), pp. 9588-9599. Date of Electronic Publication: 2021 Apr 28. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: American Chemical Society Country of Publication: United States NLM ID: 101313589 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1936-086X (Electronic) Linking ISSN: 19360851 NLM ISO Abbreviation: ACS Nano Subsets: MEDLINE; PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
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