Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films.
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| Title: | Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films. |
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| Authors: | Lin PF; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan., Tran DP; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan., Liu HC; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan., Li YY; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan., Chen C; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan. |
| Source: | Materials (Basel, Switzerland) [Materials (Basel)] 2022 Jan 26; Vol. 15 (3). Date of Electronic Publication: 2022 Jan 26. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: MDPI Country of Publication: Switzerland NLM ID: 101555929 Publication Model: Electronic Cited Medium: Print ISSN: 1996-1944 (Print) Linking ISSN: 19961944 NLM ISO Abbreviation: Materials (Basel) Subsets: PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
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| ISSN: | 1996-1944 |
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| DOI: | 10.3390/ma15030937 |
