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Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films.

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Title: Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films.
Authors: Lin PF; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan., Tran DP; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan., Liu HC; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan., Li YY; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan., Chen C; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.
Source: Materials (Basel, Switzerland) [Materials (Basel)] 2022 Jan 26; Vol. 15 (3). Date of Electronic Publication: 2022 Jan 26.
Publication Type: Journal Article
Journal Info: Publisher: MDPI Country of Publication: Switzerland NLM ID: 101555929 Publication Model: Electronic Cited Medium: Print ISSN: 1996-1944 (Print) Linking ISSN: 19961944 NLM ISO Abbreviation: Materials (Basel) Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
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PubType: Academic Journal
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  Data: Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films.
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  Data: <searchLink fieldCode="AU" term="%22Lin+PF%22">Lin PF</searchLink>; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.<br /><searchLink fieldCode="AU" term="%22Tran+DP%22">Tran DP</searchLink>; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.<br /><searchLink fieldCode="AU" term="%22Liu+HC%22">Liu HC</searchLink>; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.<br /><searchLink fieldCode="AU" term="%22Li+YY%22">Li YY</searchLink>; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.<br /><searchLink fieldCode="AU" term="%22Chen+C%22">Chen C</searchLink>; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.
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  Data: <searchLink fieldCode="JN" term="%22101555929%22">Materials (Basel, Switzerland)</searchLink> [Materials (Basel)] 2022 Jan 26; Vol. 15 (3). <i>Date of Electronic Publication: </i>2022 Jan 26.
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  Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22MDPI%22">MDPI </searchLink><i>Country of Publication: </i>Switzerland <i>NLM ID: </i>101555929 <i>Publication Model: </i>Electronic <i>Cited Medium: </i>Print <i>ISSN: </i>1996-1944 (Print) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2219961944%22">19961944 </searchLink><i>NLM ISO Abbreviation: </i>Materials (Basel) <i>Subsets: </i>PubMed not MEDLINE
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      – Type: doi
        Value: 10.3390/ma15030937
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      – Code: eng
        Text: English
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      – TitleFull: Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films.
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            NameFull: Lin PF
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            NameFull: Tran DP
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            NameFull: Liu HC
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            NameFull: Li YY
      – PersonEntity:
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            NameFull: Chen C
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            – D: 26
              M: 01
              Text: 2022 Jan 26
              Type: published
              Y: 2022
          Identifiers:
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              Value: 1996-1944
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              Value: 15
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              Value: 3
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            – TitleFull: Materials (Basel, Switzerland)
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