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Risk assessment of fungal materials.

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Title: Risk assessment of fungal materials.
Authors: van den Brandhof JG; Microbiology, Department of Biology, Utrecht University, Padualaan 8, 3584 CH, Utrecht, The Netherlands., Wösten HAB; Microbiology, Department of Biology, Utrecht University, Padualaan 8, 3584 CH, Utrecht, The Netherlands. h.a.b.wosten@uu.nl.
Source: Fungal biology and biotechnology [Fungal Biol Biotechnol] 2022 Feb 24; Vol. 9 (1), pp. 3. Date of Electronic Publication: 2022 Feb 24.
Publication Type: Journal Article; Review
Journal Info: Publisher: BioMed Central Country of Publication: England NLM ID: 101655873 Publication Model: Electronic Cited Medium: Internet ISSN: 2054-3085 (Electronic) Linking ISSN: 20543085 NLM ISO Abbreviation: Fungal Biol Biotechnol Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
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  Data: <searchLink fieldCode="AU" term="%22van+den+Brandhof+JG%22">van den Brandhof JG</searchLink>; Microbiology, Department of Biology, Utrecht University, Padualaan 8, 3584 CH, Utrecht, The Netherlands.<br /><searchLink fieldCode="AU" term="%22Wösten+HAB%22">Wösten HAB</searchLink>; Microbiology, Department of Biology, Utrecht University, Padualaan 8, 3584 CH, Utrecht, The Netherlands. h.a.b.wosten@uu.nl.
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  Data: <searchLink fieldCode="JN" term="%22101655873%22">Fungal biology and biotechnology</searchLink> [Fungal Biol Biotechnol] 2022 Feb 24; Vol. 9 (1), pp. 3. <i>Date of Electronic Publication: </i>2022 Feb 24.
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  Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22BioMed+Central%22">BioMed Central </searchLink><i>Country of Publication: </i>England <i>NLM ID: </i>101655873 <i>Publication Model: </i>Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>2054-3085 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2220543085%22">20543085 </searchLink><i>NLM ISO Abbreviation: </i>Fungal Biol Biotechnol <i>Subsets: </i>PubMed not MEDLINE
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=mdl&AN=35209958
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        Value: 10.1186/s40694-022-00134-x
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              Text: 2022 Feb 24
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