| Authors: |
Barclay MS; Micron School for Materials Science and Engineering, Boise State University, Boise, Idaho 83725, United States., Huff JS; Micron School for Materials Science and Engineering, Boise State University, Boise, Idaho 83725, United States., Pensack RD; Micron School for Materials Science and Engineering, Boise State University, Boise, Idaho 83725, United States., Davis PH; Micron School for Materials Science and Engineering, Boise State University, Boise, Idaho 83725, United States., Knowlton WB; Micron School for Materials Science and Engineering, Boise State University, Boise, Idaho 83725, United States.; Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Yurke B; Micron School for Materials Science and Engineering, Boise State University, Boise, Idaho 83725, United States.; Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Dean JC; Department of Physical Science, Southern Utah University, Cedar City, Utah 84720, United States., Arpin PC; Department of Physics, California State University, Chico, Chico, California 95929, United States., Turner DB; Micron School for Materials Science and Engineering, Boise State University, Boise, Idaho 83725, United States. |
