| Authors: |
Li XP; College of Electronic and Electrical Engineering, Henan Normal University, Xinxiang 453600, China.; Henan Key Laboratory of Optoelectronic Sensing Integrated Application, Henan Normal University, Xinxiang 453600, China.; Henan Engineering Laboratory of Additive Intelligent Manufacturing, Henan Normal University, Xinxiang 453600, China., Ma MR; College of Electronic and Electrical Engineering, Henan Normal University, Xinxiang 453600, China., Zhang QM; College of Electronic and Electrical Engineering, Henan Normal University, Xinxiang 453600, China., Yan L; College of Electronic and Electrical Engineering, Henan Normal University, Xinxiang 453600, China., Wang CQ; College of Electronic and Electrical Engineering, Henan Normal University, Xinxiang 453600, China.; Henan Key Laboratory of Optoelectronic Sensing Integrated Application, Henan Normal University, Xinxiang 453600, China.; Henan Engineering Laboratory of Additive Intelligent Manufacturing, Henan Normal University, Xinxiang 453600, China., Li W; College of Electronic and Electrical Engineering, Henan Normal University, Xinxiang 453600, China.; Henan Key Laboratory of Optoelectronic Sensing Integrated Application, Henan Normal University, Xinxiang 453600, China.; Henan Engineering Laboratory of Additive Intelligent Manufacturing, Henan Normal University, Xinxiang 453600, China. |
