APA (7th ed.) Citation

J, S., D, V., & KM, L. (2022). Bonding and the role of electrostatics in driving C-C bond formation in high valent organocopper compounds. Chemical communications (Cambridge, England), 59(1), 98. https://doi.org/10.1039/d2cc05865k

Chicago Style (17th ed.) Citation

J, Shearer, Vasiliauskas D, and Lancaster KM. "Bonding and the Role of Electrostatics in Driving C-C Bond Formation in High Valent Organocopper Compounds." Chemical Communications (Cambridge, England) 59, no. 1 (2022): 98. https://doi.org/10.1039/d2cc05865k.

MLA (9th ed.) Citation

J, Shearer, et al. "Bonding and the Role of Electrostatics in Driving C-C Bond Formation in High Valent Organocopper Compounds." Chemical Communications (Cambridge, England), vol. 59, no. 1, 2022, p. 98, https://doi.org/10.1039/d2cc05865k.