| Authors: |
Nguyen KX; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States., Huang J; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States., Karigerasi MH; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States., Kang K; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States., Cahill DG; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States; Materials Research Laboratory, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States., Zuo JM; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States; Materials Research Laboratory, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States., Schleife A; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States; Materials Research Laboratory, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States; National Center for Supercomputing Applications, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States., Shoemaker DP; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States; Materials Research Laboratory, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States., Huang PY; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States; Materials Research Laboratory, University of Illinois Urbana-Champaign, Urbana, IL 61801, United States. Electronic address: pyhuang@illinois.edu. |
