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Sub-10 nm Mixing and Alloying of Cu-Ag and Cu-Ni via Accelerated Solid Diffusion.

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Title: Sub-10 nm Mixing and Alloying of Cu-Ag and Cu-Ni via Accelerated Solid Diffusion.
Authors: Dai H; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore., Dimitriadou S; VSParticle B.V., Oostsingel 209, 2629 HL Delft, The Netherlands., Sankara Rama Krishnan PS; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore., Handoko AD; Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore 138634, Republic of Singapore., Recatala-Gomez J; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore., Wang Y; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore., Repaka DVM; Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore 138634, Republic of Singapore., Thway M; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore., Zhang C; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore., Duchamp M; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore., Hippalgaonkar K; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore.; Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore 138634, Republic of Singapore.
Source: ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2023 Jun 14; Vol. 15 (23), pp. 28398-28409. Date of Electronic Publication: 2023 May 30.
Publication Type: Journal Article
Journal Info: Publisher: American Chemical Society Country of Publication: United States NLM ID: 101504991 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1944-8252 (Electronic) Linking ISSN: 19448244 NLM ISO Abbreviation: ACS Appl Mater Interfaces Subsets: MEDLINE; PubMed not MEDLINE
Database: MEDLINE Ultimate
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PubType: Academic Journal
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  Data: Sub-10 nm Mixing and Alloying of Cu-Ag and Cu-Ni via Accelerated Solid Diffusion.
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  Data: <searchLink fieldCode="AU" term="%22Dai+H%22">Dai H</searchLink>; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore.<br /><searchLink fieldCode="AU" term="%22Dimitriadou+S%22">Dimitriadou S</searchLink>; VSParticle B.V., Oostsingel 209, 2629 HL Delft, The Netherlands.<br /><searchLink fieldCode="AU" term="%22Sankara+Rama+Krishnan+PS%22">Sankara Rama Krishnan PS</searchLink>; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore.<br /><searchLink fieldCode="AU" term="%22Handoko+AD%22">Handoko AD</searchLink>; Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore 138634, Republic of Singapore.<br /><searchLink fieldCode="AU" term="%22Recatala-Gomez+J%22">Recatala-Gomez J</searchLink>; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore.<br /><searchLink fieldCode="AU" term="%22Wang+Y%22">Wang Y</searchLink>; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore.<br /><searchLink fieldCode="AU" term="%22Repaka+DVM%22">Repaka DVM</searchLink>; Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore 138634, Republic of Singapore.<br /><searchLink fieldCode="AU" term="%22Thway+M%22">Thway M</searchLink>; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore.<br /><searchLink fieldCode="AU" term="%22Zhang+C%22">Zhang C</searchLink>; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore.<br /><searchLink fieldCode="AU" term="%22Duchamp+M%22">Duchamp M</searchLink>; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore.<br /><searchLink fieldCode="AU" term="%22Hippalgaonkar+K%22">Hippalgaonkar K</searchLink>; School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore.; Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore 138634, Republic of Singapore.
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  Data: <searchLink fieldCode="JN" term="%22101504991%22">ACS applied materials & interfaces</searchLink> [ACS Appl Mater Interfaces] 2023 Jun 14; Vol. 15 (23), pp. 28398-28409. <i>Date of Electronic Publication: </i>2023 May 30.
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  Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22American+Chemical+Society%22">American Chemical Society </searchLink><i>Country of Publication: </i>United States <i>NLM ID: </i>101504991 <i>Publication Model: </i>Print-Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>1944-8252 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2219448244%22">19448244 </searchLink><i>NLM ISO Abbreviation: </i>ACS Appl Mater Interfaces <i>Subsets: </i>MEDLINE; PubMed not MEDLINE
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      – Type: doi
        Value: 10.1021/acsami.3c04124
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        Text: English
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      – TitleFull: Sub-10 nm Mixing and Alloying of Cu-Ag and Cu-Ni via Accelerated Solid Diffusion.
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            – D: 14
              M: 06
              Text: 2023 Jun 14
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              Y: 2023
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