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Conformal in-ear bioelectronics for visual and auditory brain-computer interfaces.

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Title: Conformal in-ear bioelectronics for visual and auditory brain-computer interfaces.
Authors: Wang Z; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Shi N; Department of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Zhang Y; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Zheng N; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, China., Li H; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Jiao Y; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Cheng J; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Wang Y; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Zhang X; Department of Otolaryngology-Head and Neck Surgery, Beijing Tongren Hospital, Capital Medical University, Beijing, 100730, China., Chen Y; Institute of Flexible Electronics Technology of THU, Zhejiang, Jiaxing, 314000, China., Chen Y; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Wang H; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Xie T; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, China., Wang Y; Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China., Ma Y; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. mayinji@tsinghua.edu.cn.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China. mayinji@tsinghua.edu.cn., Gao X; Department of Biomedical Engineering, Tsinghua University, Beijing, 100084, China. gxr-dea@mail.tsinghua.edu.cn., Feng X; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. fengxue@tsinghua.edu.cn.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China. fengxue@tsinghua.edu.cn.
Source: Nature communications [Nat Commun] 2023 Jul 14; Vol. 14 (1), pp. 4213. Date of Electronic Publication: 2023 Jul 14.
Publication Type: Journal Article; Research Support, Non-U.S. Gov't
Journal Info: Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE
Database: MEDLINE Ultimate
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  Data: <searchLink fieldCode="AU" term="%22Wang+Z%22">Wang Z</searchLink>; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China.<br /><searchLink fieldCode="AU" term="%22Shi+N%22">Shi N</searchLink>; Department of Biomedical Engineering, Tsinghua University, Beijing, 100084, China.<br /><searchLink fieldCode="AU" term="%22Zhang+Y%22">Zhang Y</searchLink>; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China.<br /><searchLink fieldCode="AU" term="%22Zheng+N%22">Zheng N</searchLink>; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, China.<br /><searchLink fieldCode="AU" term="%22Li+H%22">Li H</searchLink>; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China.<br /><searchLink fieldCode="AU" term="%22Jiao+Y%22">Jiao Y</searchLink>; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China.<br /><searchLink fieldCode="AU" term="%22Cheng+J%22">Cheng J</searchLink>; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China.<br /><searchLink fieldCode="AU" term="%22Wang+Y%22">Wang Y</searchLink>; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China.<br /><searchLink fieldCode="AU" term="%22Zhang+X%22">Zhang X</searchLink>; Department of Otolaryngology-Head and Neck Surgery, Beijing Tongren Hospital, Capital Medical University, Beijing, 100730, China.<br /><searchLink fieldCode="AU" term="%22Chen+Y%22">Chen Y</searchLink>; Institute of Flexible Electronics Technology of THU, Zhejiang, Jiaxing, 314000, China.<br /><searchLink fieldCode="AU" term="%22Chen+Y%22">Chen Y</searchLink>; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China.<br /><searchLink fieldCode="AU" term="%22Wang+H%22">Wang H</searchLink>; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China.<br /><searchLink fieldCode="AU" term="%22Xie+T%22">Xie T</searchLink>; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, China.<br /><searchLink fieldCode="AU" term="%22Wang+Y%22">Wang Y</searchLink>; Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China.<br /><searchLink fieldCode="AU" term="%22Ma+Y%22">Ma Y</searchLink>; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. mayinji@tsinghua.edu.cn.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China. mayinji@tsinghua.edu.cn.<br /><searchLink fieldCode="AU" term="%22Gao+X%22">Gao X</searchLink>; Department of Biomedical Engineering, Tsinghua University, Beijing, 100084, China. gxr-dea@mail.tsinghua.edu.cn.<br /><searchLink fieldCode="AU" term="%22Feng+X%22">Feng X</searchLink>; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. fengxue@tsinghua.edu.cn.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China. fengxue@tsinghua.edu.cn.
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  Data: <searchLink fieldCode="JN" term="%22101528555%22">Nature communications</searchLink> [Nat Commun] 2023 Jul 14; Vol. 14 (1), pp. 4213. <i>Date of Electronic Publication: </i>2023 Jul 14.
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