Conformal in-ear bioelectronics for visual and auditory brain-computer interfaces.
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| Title: | Conformal in-ear bioelectronics for visual and auditory brain-computer interfaces. |
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| Authors: | Wang Z; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Shi N; Department of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Zhang Y; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Zheng N; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, China., Li H; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Jiao Y; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Cheng J; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Wang Y; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Zhang X; Department of Otolaryngology-Head and Neck Surgery, Beijing Tongren Hospital, Capital Medical University, Beijing, 100730, China., Chen Y; Institute of Flexible Electronics Technology of THU, Zhejiang, Jiaxing, 314000, China., Chen Y; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Wang H; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China., Xie T; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, China., Wang Y; Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China., Ma Y; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. mayinji@tsinghua.edu.cn.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China. mayinji@tsinghua.edu.cn., Gao X; Department of Biomedical Engineering, Tsinghua University, Beijing, 100084, China. gxr-dea@mail.tsinghua.edu.cn., Feng X; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. fengxue@tsinghua.edu.cn.; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China. fengxue@tsinghua.edu.cn. |
| Source: | Nature communications [Nat Commun] 2023 Jul 14; Vol. 14 (1), pp. 4213. Date of Electronic Publication: 2023 Jul 14. |
| Publication Type: | Journal Article; Research Support, Non-U.S. Gov't |
| Journal Info: | Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE |
| Database: | MEDLINE Ultimate |
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