| Authors: |
Huff JS; Micron School of Materials Science and Engineering, Boise State University, Boise, Idaho 83725, USA., Duncan KM; Micron School of Materials Science and Engineering, Boise State University, Boise, Idaho 83725, USA., van Galen CJ; Department of Chemistry, Temple University, Philadelphia, Pennsylvania 19122, USA., Barclay MS; Micron School of Materials Science and Engineering, Boise State University, Boise, Idaho 83725, USA., Knowlton WB; Micron School of Materials Science and Engineering, Boise State University, Boise, Idaho 83725, USA.; Department of Electrical and Computer Engineering, Boise State University, Boise, Idaho 83725, USA., Yurke B; Micron School of Materials Science and Engineering, Boise State University, Boise, Idaho 83725, USA.; Department of Electrical and Computer Engineering, Boise State University, Boise, Idaho 83725, USA., Davis PH; Micron School of Materials Science and Engineering, Boise State University, Boise, Idaho 83725, USA.; Center for Advanced Energy Studies, Idaho Falls, Idaho 83401, USA., Turner DB; Micron School of Materials Science and Engineering, Boise State University, Boise, Idaho 83725, USA., Stanley RJ; Department of Chemistry, Temple University, Philadelphia, Pennsylvania 19122, USA., Pensack RD; Micron School of Materials Science and Engineering, Boise State University, Boise, Idaho 83725, USA. |
