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A Cross-Process Signal Integrity Analysis (CPSIA) Method and Design Optimization for Wafer-on-Wafer Stacked DRAM.

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Bibliographic Details
Title: A Cross-Process Signal Integrity Analysis (CPSIA) Method and Design Optimization for Wafer-on-Wafer Stacked DRAM.
Authors: Jiang X; Institute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China.; School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100029, China.; Xi'an UniIC Semiconductors, Xi'an 710075, China., Jia X; Xi'an UniIC Semiconductors, Xi'an 710075, China.; School of Microelectronics, Xi'an Jiaotong University, Xianning West Road 28#, Xi'an 710049, China., Wang S; Xi'an UniIC Semiconductors, Xi'an 710075, China., Guo Y; Xi'an UniIC Semiconductors, Xi'an 710075, China., Guo F; Xi'an UniIC Semiconductors, Xi'an 710075, China., Long X; Xi'an UniIC Semiconductors, Xi'an 710075, China., Geng L; School of Microelectronics, Xi'an Jiaotong University, Xianning West Road 28#, Xi'an 710049, China., Yang J; School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100029, China., Liu M; Institute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China.; School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100029, China.
Source: Micromachines [Micromachines (Basel)] 2024 Apr 23; Vol. 15 (5). Date of Electronic Publication: 2024 Apr 23.
Publication Type: Journal Article
Journal Info: Publisher: MDPI Country of Publication: Switzerland NLM ID: 101640903 Publication Model: Electronic Cited Medium: Print ISSN: 2072-666X (Print) Linking ISSN: 2072666X NLM ISO Abbreviation: Micromachines (Basel) Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
Description
ISSN:2072-666X
DOI:10.3390/mi15050557