| Authors: |
Liang W; School of Biomedical Engineering, Suzhou Institute for Advanced Research, University of Science and Technology of China, Suzhou, Jiangsu 215000, China; School of Physical Sciences, University of Science and Technology of China, Hefei, Anhui 230026, China., Chen D; Department of Biomedical Engineering, Johns Hopkins University, Baltimore, Maryland 21205, United States., Guan H; Department of Electrical and Computer Engineering, Johns Hopkins University, Baltimore, Maryland 21218, United States., Park HC; Department of Biomedical Engineering, Johns Hopkins University, Baltimore, Maryland 21205, United States., Li K; Department of Biomedical Engineering, Johns Hopkins University, Baltimore, Maryland 21205, United States., Li A; Department of Biomedical Engineering, Johns Hopkins University, Baltimore, Maryland 21205, United States., Li MJ; Science and Technology Division, Corning Incorporated, Corning, New York 14831, United States., Gannot I; Department of Electrical and Computer Engineering, Johns Hopkins University, Baltimore, Maryland 21218, United States., Li X; Department of Biomedical Engineering, Johns Hopkins University, Baltimore, Maryland 21205, United States; Department of Electrical and Computer Engineering, Johns Hopkins University, Baltimore, Maryland 21218, United States. |
