C, A., R, A., D, S., NC, O., & W, Z. (2025). Sequential reduction of bivalent copper and nickel in electroplating wastewater using bioelectrochemical systems inoculated with novel Enterococcus species. Bioprocess and biosystems engineering, 48(9), 1599. https://doi.org/10.1007/s00449-025-03199-1
Chicago Style (17th ed.) CitationC, Amanze, Anaman R, Ssekimpi D, Ontita NC, and Zeng W. "Sequential Reduction of Bivalent Copper and Nickel in Electroplating Wastewater Using Bioelectrochemical Systems Inoculated with Novel Enterococcus Species." Bioprocess and Biosystems Engineering 48, no. 9 (2025): 1599. https://doi.org/10.1007/s00449-025-03199-1.
MLA (9th ed.) CitationC, Amanze, et al. "Sequential Reduction of Bivalent Copper and Nickel in Electroplating Wastewater Using Bioelectrochemical Systems Inoculated with Novel Enterococcus Species." Bioprocess and Biosystems Engineering, vol. 48, no. 9, 2025, p. 1599, https://doi.org/10.1007/s00449-025-03199-1.