| Authors: |
Zhao J; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Wang S; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Huang L; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Zhong H; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Lv W; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Mao Z; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Deng A; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Shi Y; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Huang Q; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China., Fu R; School of Medical Technology, Beijing Institute of Technology, Beijing, 100081, China; Engineering Research Center of Integrated Acousto-opto-electronic Microsystems (Ministry of Education of China), Beijing Institute of Technology, Beijing, 100081, China., Huang G; School of Biomedical Engineering, Tsinghua University, Beijing, 100084, China; National Engineering Research Center for Beijing Biochip Technology, Beijing, 102206, China. Electronic address: tshgl@mail.tsinghua.edu.cn. |
