| Authors: |
Men M; School of Physics and Optoelectronic Engineering, Beijing University of Technology, Beijing, China., Deng Z; School of Aerospace Engineering & State Key Laboratory of Environment Characteristics and Effects for Near-space, Beijing institute of technology, Beijing, China.; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Gansu Integrated Circuit Packaging and Testing Industry Research Institute, Tianshui Normal University, Tianshui, P. R. China., Zhao Z; School of Physics and Optoelectronic Engineering, Beijing University of Technology, Beijing, China., Liu L; State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China., Cui Y; School of Aerospace Engineering & State Key Laboratory of Environment Characteristics and Effects for Near-space, Beijing institute of technology, Beijing, China., Jin S; School of Aerospace Engineering & State Key Laboratory of Environment Characteristics and Effects for Near-space, Beijing institute of technology, Beijing, China., Xie Y; Key Laboratory of Optoelectronics Technology, Ministry of Education, Beijing University of Technology, Beijing, China., Jiang X; Institute of Micro/Nano Materials and Devices, Ningbo University of Technology, Ningbo, China., Ren W; Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu, China., Hong J; School of Aerospace Engineering & State Key Laboratory of Environment Characteristics and Effects for Near-space, Beijing institute of technology, Beijing, China., Wu J; Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu, China., Cheong SW; Department of Physics and Astronomy, Rutgers University, Piscataway, NJ, USA., Chang P; Key Laboratory of Optoelectronics Technology, Ministry of Education, Beijing University of Technology, Beijing, China. pychang@bjut.edu.cn., Wang L; State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China. liliwang@semi.ac.cn., Wang X; School of Aerospace Engineering & State Key Laboratory of Environment Characteristics and Effects for Near-space, Beijing institute of technology, Beijing, China. xueyun@bit.edu.cn., Wang X; School of Physics and Optoelectronic Engineering, Beijing University of Technology, Beijing, China. xiaoleiwang@bjut.edu.cn. |
