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Governing Thermal Transport in Three-Dimensional Electronics.

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Title: Governing Thermal Transport in Three-Dimensional Electronics.
Authors: Kim K; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea., Jin M; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; Research Institute for Convergence Science, Seoul National University, Seoul 08826, Republic of Korea., Bae S; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, Missouri 63130, United States., Lee S; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, Missouri 63130, United States., Han S; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States., Meng Y; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States., Choi Y; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States., Kim SI; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States., Moon JY; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; Division of Electronics and Electrical Engineering, Dongguk University, Seoul 04620, Republic of Korea., Kim JS; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States., Xu Z; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States., Lee JH; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea., Lee SK; School of Materials Science and Engineering, Pusan National University, 30 Jangjeon-Dong Geumjeong-Gu, Busan 46241, Republic of Korea.; Institute of Materials Technology, Pusan National University, 30 Jangjeon-Dong Geumjeong-Gu, Busan 46241, Republic of Korea., Park JW; R&D Center of JB Lab Corporation, Seoul 08788, Republic of Korea., Bae SH; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; Research Institute for Convergence Science, Seoul National University, Seoul 08826, Republic of Korea.
Source: ACS nano [ACS Nano] 2026 Jun 23; Vol. 20 (24), pp. 17119-17142. Date of Electronic Publication: 2026 Jun 06.
Publication Type: Journal Article; Review
Journal Info: Publisher: American Chemical Society Country of Publication: United States NLM ID: 101313589 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1936-086X (Electronic) Linking ISSN: 19360851 NLM ISO Abbreviation: ACS Nano Subsets: MEDLINE; PubMed not MEDLINE
Database: MEDLINE Ultimate
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  Data: <searchLink fieldCode="AU" term="%22Kim+K%22">Kim K</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Jin+M%22">Jin M</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; Research Institute for Convergence Science, Seoul National University, Seoul 08826, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Bae+S%22">Bae S</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Lee+S%22">Lee S</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Han+S%22">Han S</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Meng+Y%22">Meng Y</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Choi+Y%22">Choi Y</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Kim+SI%22">Kim SI</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Moon+JY%22">Moon JY</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; Division of Electronics and Electrical Engineering, Dongguk University, Seoul 04620, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kim+JS%22">Kim JS</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Xu+Z%22">Xu Z</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Lee+JH%22">Lee JH</searchLink>; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Lee+SK%22">Lee SK</searchLink>; School of Materials Science and Engineering, Pusan National University, 30 Jangjeon-Dong Geumjeong-Gu, Busan 46241, Republic of Korea.; Institute of Materials Technology, Pusan National University, 30 Jangjeon-Dong Geumjeong-Gu, Busan 46241, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Park+JW%22">Park JW</searchLink>; R&D Center of JB Lab Corporation, Seoul 08788, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Bae+SH%22">Bae SH</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, Missouri 63130, United States.; Research Institute for Convergence Science, Seoul National University, Seoul 08826, Republic of Korea.
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  Data: <searchLink fieldCode="JN" term="%22101313589%22">ACS nano</searchLink> [ACS Nano] 2026 Jun 23; Vol. 20 (24), pp. 17119-17142. <i>Date of Electronic Publication: </i>2026 Jun 06.
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              Text: 2026 Jun 23
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