| Authors: |
Wu H; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Gao H; School of Computer Science and Engineering, University of New South Wales, Sydney, New South Wales, Australia., Liu Q; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Yuan S; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Fang H; Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China., Su M; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Liang B; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Yang Y; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Bai L; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Dong W; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Xie D; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Su S; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Lai J; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China., Cheng SS; Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China., Li Z; Qilu Hospital of Shandong University, Jinan, Shandong, China., Zuo X; Qilu Hospital of Shandong University, Jinan, Shandong, China., Ren H; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China. |
