APA (7th ed.) Citation

CP, H., MH, S., CC, H., & SJ, H. (2026). Finite element analysis of warpage and debonding behavior in RDL-first and molding-first fan-out panel-level packaging. Scientific reports. https://doi.org/10.1038/s41598-026-47275-2

Chicago Style (17th ed.) Citation

CP, Hu, Shih MH, Hung CC, and Hwang SJ. "Finite Element Analysis of Warpage and Debonding Behavior in RDL-first and Molding-first Fan-out Panel-level Packaging." Scientific Reports 2026. https://doi.org/10.1038/s41598-026-47275-2.

MLA (9th ed.) Citation

CP, Hu, et al. "Finite Element Analysis of Warpage and Debonding Behavior in RDL-first and Molding-first Fan-out Panel-level Packaging." Scientific Reports, 2026, https://doi.org/10.1038/s41598-026-47275-2.