Finite element analysis of warpage and debonding behavior in RDL-first and molding-first fan-out panel-level packaging.
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| Title: | Finite element analysis of warpage and debonding behavior in RDL-first and molding-first fan-out panel-level packaging. |
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| Authors: | Hu CP; Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan., Shih MH; Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan, 710301, Taiwan., Hung CC; Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan., Hwang SJ; Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan. jimppl@mail.ncku.edu.tw. |
| Source: | Scientific reports [Sci Rep] 2026 Jun 15. Date of Electronic Publication: 2026 Jun 15. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: Nature Publishing Group Country of Publication: England NLM ID: 101563288 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2045-2322 (Electronic) Linking ISSN: 20452322 NLM ISO Abbreviation: Sci Rep Subsets: MEDLINE |
| Database: | MEDLINE Ultimate |
| FullText | Text: Availability: 0 |
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| Header | DbId: mdl DbLabel: MEDLINE Ultimate An: 42297853 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Finite element analysis of warpage and debonding behavior in RDL-first and molding-first fan-out panel-level packaging. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Hu+CP%22">Hu CP</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan.<br /><searchLink fieldCode="AU" term="%22Shih+MH%22">Shih MH</searchLink>; Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan, 710301, Taiwan.<br /><searchLink fieldCode="AU" term="%22Hung+CC%22">Hung CC</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan.<br /><searchLink fieldCode="AU" term="%22Hwang+SJ%22">Hwang SJ</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan. jimppl@mail.ncku.edu.tw. – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22101563288%22">Scientific reports</searchLink> [Sci Rep] 2026 Jun 15. <i>Date of Electronic Publication: </i>2026 Jun 15. – Name: TypePub Label: Publication Type Group: TypPub Data: Journal Article – Name: TitleSource Label: Journal Info Group: Src Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22Nature+Publishing+Group%22">Nature Publishing Group </searchLink><i>Country of Publication: </i>England <i>NLM ID: </i>101563288 <i>Publication Model: </i>Print-Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>2045-2322 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2220452322%22">20452322 </searchLink><i>NLM ISO Abbreviation: </i>Sci Rep <i>Subsets: </i>MEDLINE |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=mdl&AN=42297853 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1038/s41598-026-47275-2 Languages: – Code: eng Text: English Titles: – TitleFull: Finite element analysis of warpage and debonding behavior in RDL-first and molding-first fan-out panel-level packaging. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Hu CP – PersonEntity: Name: NameFull: Shih MH – PersonEntity: Name: NameFull: Hung CC – PersonEntity: Name: NameFull: Hwang SJ IsPartOfRelationships: – BibEntity: Dates: – D: 15 M: 06 Text: 2026 Jun 15 Type: published Y: 2026 Identifiers: – Type: issn-electronic Value: 2045-2322 Titles: – TitleFull: Scientific reports Type: main |
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