Finite element analysis of warpage and debonding behavior in RDL-first and molding-first fan-out panel-level packaging.
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| Title: | Finite element analysis of warpage and debonding behavior in RDL-first and molding-first fan-out panel-level packaging. |
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| Authors: | Hu CP; Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan., Shih MH; Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan, 710301, Taiwan., Hung CC; Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan., Hwang SJ; Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan. jimppl@mail.ncku.edu.tw. |
| Source: | Scientific reports [Sci Rep] 2026 Jun 15. Date of Electronic Publication: 2026 Jun 15. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: Nature Publishing Group Country of Publication: England NLM ID: 101563288 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2045-2322 (Electronic) Linking ISSN: 20452322 NLM ISO Abbreviation: Sci Rep Subsets: MEDLINE |
| Database: | MEDLINE Ultimate |
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