Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films.
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| Title: | Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films. |
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| Authors: | Beche, E., elodie.beche@cea.fr, Fournel, F., Larrey, V., Rieutord, F., Fillot, F. |
| Source: | Microsystem Technologies; May2015, Vol. 21 Issue 5, p953-959, 7p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09467076 |
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| DOI: | 10.1007/s00542-015-2437-3 |
