APA (7th ed.) Citation

Beche, E., Fournel, F., Larrey, V., Rieutord, F., & Fillot, F. (2015). Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films. Microsystem Technologies, 21(5), 953. https://doi.org/10.1007/s00542-015-2437-3

Chicago Style (17th ed.) Citation

Beche, E., F. Fournel, V. Larrey, F. Rieutord, and F. Fillot. "Direct Wafer Bonding of Amorphous or Densified Atomic Layer Deposited Alumina Thin Films." Microsystem Technologies 21, no. 5 (2015): 953. https://doi.org/10.1007/s00542-015-2437-3.

MLA (9th ed.) Citation

Beche, E., et al. "Direct Wafer Bonding of Amorphous or Densified Atomic Layer Deposited Alumina Thin Films." Microsystem Technologies, vol. 21, no. 5, 2015, p. 953, https://doi.org/10.1007/s00542-015-2437-3.