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Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films.

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Bibliographic Details
Title: Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films.
Authors: Beche, E., elodie.beche@cea.fr, Fournel, F., Larrey, V., Rieutord, F., Fillot, F.
Source: Microsystem Technologies; May2015, Vol. 21 Issue 5, p953-959, 7p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 102187319
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films.
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  Data: <searchLink fieldCode="AU" term="%22Beche%2C+E%2E%22">Beche, E.</searchLink>, <i>elodie.beche@cea.fr</i><br /><searchLink fieldCode="AU" term="%22Fournel%2C+F%2E%22">Fournel, F.</searchLink><br /><searchLink fieldCode="AU" term="%22Larrey%2C+V%2E%22">Larrey, V.</searchLink><br /><searchLink fieldCode="AU" term="%22Rieutord%2C+F%2E%22">Rieutord, F.</searchLink><br /><searchLink fieldCode="AU" term="%22Fillot%2C+F%2E%22">Fillot, F.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Microsystem+Technologies%22">Microsystem Technologies</searchLink>; May2015, Vol. 21 Issue 5, p953-959, 7p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=102187319
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s00542-015-2437-3
    Languages:
      – Code: eng
        Text: English
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        PageCount: 7
        StartPage: 953
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      – TitleFull: Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films.
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            NameFull: Beche, E.
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            NameFull: Fournel, F.
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            NameFull: Larrey, V.
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            NameFull: Rieutord, F.
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              Text: May2015
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              Y: 2015
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              Value: 21
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