Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.
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| Title: | Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging. |
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| Authors: | Garnier, Arnaud1, Baillin, Xavier1, Hodaj, Fiqiri, fhodaj@simap.grenoble-inp.fr |
| Source: | Journal of Materials Science: Materials in Electronics; Jun2015, Vol. 26 Issue 6, p3427-3439, 13p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-015-2852-3 |
