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Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.

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Title: Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.
Authors: Garnier, Arnaud1, Baillin, Xavier1, Hodaj, Fiqiri, fhodaj@simap.grenoble-inp.fr
Source: Journal of Materials Science: Materials in Electronics; Jun2015, Vol. 26 Issue 6, p3427-3439, 13p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
An: 102603652
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PubType: Academic Journal
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  Data: Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2015, Vol. 26 Issue 6, p3427-3439, 13p
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        Value: 10.1007/s10854-015-2852-3
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      – Code: eng
        Text: English
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        PageCount: 13
        StartPage: 3427
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      – TitleFull: Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.
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            NameFull: Garnier, Arnaud
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            NameFull: Baillin, Xavier
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            – D: 01
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              Text: Jun2015
              Type: published
              Y: 2015
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              Value: 26
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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