Fumed-Alumina-Derived Nanoporous Alumina as a New Low- k Dielectric Material for Microelectronics Packaging.

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Bibliographic Details
Title:	Fumed-Alumina-Derived Nanoporous Alumina as a New Low- k Dielectric Material for Microelectronics Packaging.
Authors:	Takizawa, Yoshihiro¹, Chung, D.¹, ddlchung@buffalo.edu
Source:	Journal of Electronic Materials; Jul2015, Vol. 44 Issue 7, p2211-2220, 10p, 2 Diagrams, 3 Charts, 3 Graphs
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-015-3667-y