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Fumed-Alumina-Derived Nanoporous Alumina as a New Low- k Dielectric Material for Microelectronics Packaging.

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Title: Fumed-Alumina-Derived Nanoporous Alumina as a New Low- k Dielectric Material for Microelectronics Packaging.
Authors: Takizawa, Yoshihiro1, Chung, D.1, ddlchung@buffalo.edu
Source: Journal of Electronic Materials; Jul2015, Vol. 44 Issue 7, p2211-2220, 10p, 2 Diagrams, 3 Charts, 3 Graphs
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
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PubType: Academic Journal
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  Data: Fumed-Alumina-Derived Nanoporous Alumina as a New Low- k Dielectric Material for Microelectronics Packaging.
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        Value: 10.1007/s11664-015-3667-y
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      – Code: eng
        Text: English
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        PageCount: 10
        StartPage: 2211
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      – TitleFull: Fumed-Alumina-Derived Nanoporous Alumina as a New Low- k Dielectric Material for Microelectronics Packaging.
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              Text: Jul2015
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              Y: 2015
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