Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.
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| Title: | Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging. |
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| Authors: | Zhang, Liang, zhangliang@jsnu.edu.cn, Sun, Lei1, Han, Ji-guang1, Guo, Yong-huan1 |
| Source: | Journal of Materials Science: Materials in Electronics; Aug2015, Vol. 26 Issue 8, p6194-6197, 4p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-015-3202-1 |
