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Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.

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Title: Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.
Authors: Zhang, Liang, zhangliang@jsnu.edu.cn, Sun, Lei1, Han, Ji-guang1, Guo, Yong-huan1
Source: Journal of Materials Science: Materials in Electronics; Aug2015, Vol. 26 Issue 8, p6194-6197, 4p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 108330620
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.
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  Data: <searchLink fieldCode="AU" term="%22Zhang%2C+Liang%22">Zhang, Liang</searchLink>, <i>zhangliang@jsnu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Sun%2C+Lei%22">Sun, Lei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Han%2C+Ji-guang%22">Han, Ji-guang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Yong-huan%22">Guo, Yong-huan</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Aug2015, Vol. 26 Issue 8, p6194-6197, 4p
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      – Type: doi
        Value: 10.1007/s10854-015-3202-1
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      – Code: eng
        Text: English
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        StartPage: 6194
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      – TitleFull: Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.
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            NameFull: Zhang, Liang
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            NameFull: Sun, Lei
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            NameFull: Han, Ji-guang
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              Text: Aug2015
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              Y: 2015
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