On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking.

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Bibliographic Details
Title:	On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking.
Authors:	Duckhwan Kim¹, kimduckhwan@gatech.edu, Mukhopadhyay, Saibal¹, saibal@ece.gatech.edu
Source:	DAC: Annual ACM/IEEE Design Automation Conference; 2014, p149-154, 6p
Database:	Applied Science & Technology Source

Description
ISSN:	0738100X
DOI:	10.1145/2593069.2593168