APA (7th ed.) Citation

Kim, D., & Mukhopadhyay, S. (2014). On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking. DAC: Annual ACM/IEEE Design Automation Conference, 149. https://doi.org/10.1145/2593069.2593168

Chicago Style (17th ed.) Citation

Kim, Duckhwan, and Saibal Mukhopadhyay. "On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking." DAC: Annual ACM/IEEE Design Automation Conference 2014: 149. https://doi.org/10.1145/2593069.2593168.

MLA (9th ed.) Citation

Kim, Duckhwan, and Saibal Mukhopadhyay. "On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking." DAC: Annual ACM/IEEE Design Automation Conference, 2014, p. 149, https://doi.org/10.1145/2593069.2593168.