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On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking.

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Title: On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking.
Authors: Duckhwan Kim1, kimduckhwan@gatech.edu, Mukhopadhyay, Saibal1, saibal@ece.gatech.edu
Source: DAC: Annual ACM/IEEE Design Automation Conference; 2014, p149-154, 6p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
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  Data: On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking.
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        Value: 10.1145/2593069.2593168
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 149
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      – TitleFull: On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking.
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            NameFull: Duckhwan Kim
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            NameFull: Mukhopadhyay, Saibal
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            – D: 01
              M: 01
              Text: 2014
              Type: published
              Y: 2014
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