On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking.
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| Title: | On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking. |
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| Authors: | Duckhwan Kim1, kimduckhwan@gatech.edu, Mukhopadhyay, Saibal1, saibal@ece.gatech.edu |
| Source: | DAC: Annual ACM/IEEE Design Automation Conference; 2014, p149-154, 6p |
| Database: | Applied Science & Technology Source |
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