Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder.
Saved in:
| Title: | Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder. |
|---|---|
| Authors: | Yamaguchi, T., takuto.yamaguchi.xu@hitachi.com, Ikeda, O.1, Oda, Y.2, ODA.YU@neomax.co.jp, Hata, S.3, Kuroki, K.3, Kuroda, H.3, Hirose, A.4 |
| Source: | Journal of Electronic Materials; Dec2015, Vol. 44 Issue 12, p4769-4778, 10p, 3 Color Photographs, 11 Diagrams, 1 Chart, 5 Graphs |
| Database: | Applied Science & Technology Source |
| ISSN: | 03615235 |
|---|---|
| DOI: | 10.1007/s11664-015-4105-x |
