APA (7th ed.) Citation

Yamaguchi, T., Ikeda, O., Oda, Y., Hata, S., Kuroki, K., Kuroda, H., & Hirose, A. (2015). Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder. Journal of Electronic Materials, 44(12), 4769. https://doi.org/10.1007/s11664-015-4105-x

Chicago Style (17th ed.) Citation

Yamaguchi, T., O. Ikeda, Y. Oda, S. Hata, K. Kuroki, H. Kuroda, and A. Hirose. "Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder." Journal of Electronic Materials 44, no. 12 (2015): 4769. https://doi.org/10.1007/s11664-015-4105-x.

MLA (9th ed.) Citation

Yamaguchi, T., et al. "Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder." Journal of Electronic Materials, vol. 44, no. 12, 2015, p. 4769, https://doi.org/10.1007/s11664-015-4105-x.