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Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder.

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Title: Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder.
Authors: Yamaguchi, T., takuto.yamaguchi.xu@hitachi.com, Ikeda, O.1, Oda, Y.2, ODA.YU@neomax.co.jp, Hata, S.3, Kuroki, K.3, Kuroda, H.3, Hirose, A.4
Source: Journal of Electronic Materials; Dec2015, Vol. 44 Issue 12, p4769-4778, 10p, 3 Color Photographs, 11 Diagrams, 1 Chart, 5 Graphs
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 110569779
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder.
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  Data: <searchLink fieldCode="AU" term="%22Yamaguchi%2C+T%2E%22">Yamaguchi, T.</searchLink>, <i>takuto.yamaguchi.xu@hitachi.com</i><br /><searchLink fieldCode="AU" term="%22Ikeda%2C+O%2E%22">Ikeda, O.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Oda%2C+Y%2E%22">Oda, Y.</searchLink><relatesTo>2</relatesTo>, <i>ODA.YU@neomax.co.jp</i><br /><searchLink fieldCode="AU" term="%22Hata%2C+S%2E%22">Hata, S.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Kuroki%2C+K%2E%22">Kuroki, K.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Kuroda%2C+H%2E%22">Kuroda, H.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Hirose%2C+A%2E%22">Hirose, A.</searchLink><relatesTo>4</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Dec2015, Vol. 44 Issue 12, p4769-4778, 10p, 3 Color Photographs, 11 Diagrams, 1 Chart, 5 Graphs
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        Value: 10.1007/s11664-015-4105-x
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      – Code: eng
        Text: English
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        StartPage: 4769
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      – TitleFull: Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder.
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            – D: 01
              M: 12
              Text: Dec2015
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              Y: 2015
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