Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer.
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| Title: | Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer. |
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| Authors: | Chien-Hsun Chuang1, josh604@hotmail.com, Yan-Cheng Lin2, d02527013@ntu.edu.tw, Che-Wei Lin2, r98527029@ntu.edu.tw |
| Source: | Metals (2075-4701); Apr2016, Vol. 6 Issue 4, p92, 10p |
| Database: | Applied Science & Technology Source |
| ISSN: | 20754701 |
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| DOI: | 10.3390/met6040092 |
