APA (7th ed.) Citation

Chuang, C., Lin, Y., & Lin, C. (2016). Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer. Metals (2075-4701), 6(4), 92. https://doi.org/10.3390/met6040092

Chicago Style (17th ed.) Citation

Chuang, Chien-Hsun, Yan-Cheng Lin, and Che-Wei Lin. "Intermetallic Reactions During the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer." Metals (2075-4701) 6, no. 4 (2016): 92. https://doi.org/10.3390/met6040092.

MLA (9th ed.) Citation

Chuang, Chien-Hsun, et al. "Intermetallic Reactions During the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer." Metals (2075-4701), vol. 6, no. 4, 2016, p. 92, https://doi.org/10.3390/met6040092.