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Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer.

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Title: Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer.
Authors: Chien-Hsun Chuang1, josh604@hotmail.com, Yan-Cheng Lin2, d02527013@ntu.edu.tw, Che-Wei Lin2, r98527029@ntu.edu.tw
Source: Metals (2075-4701); Apr2016, Vol. 6 Issue 4, p92, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
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PubType: Academic Journal
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  Data: Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer.
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  Data: <searchLink fieldCode="AU" term="%22Chien-Hsun+Chuang%22">Chien-Hsun Chuang</searchLink><relatesTo>1</relatesTo>, <i>josh604@hotmail.com</i><br /><searchLink fieldCode="AU" term="%22Yan-Cheng+Lin%22">Yan-Cheng Lin</searchLink><relatesTo>2</relatesTo>, <i>d02527013@ntu.edu.tw</i><br /><searchLink fieldCode="AU" term="%22Che-Wei+Lin%22">Che-Wei Lin</searchLink><relatesTo>2</relatesTo>, <i>r98527029@ntu.edu.tw</i>
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  Data: <searchLink fieldCode="JN" term="%22Metals+%282075-4701%29%22">Metals (2075-4701)</searchLink>; Apr2016, Vol. 6 Issue 4, p92, 10p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=115556230
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        Value: 10.3390/met6040092
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      – Code: eng
        Text: English
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      – TitleFull: Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer.
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            NameFull: Chien-Hsun Chuang
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            NameFull: Yan-Cheng Lin
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              Text: Apr2016
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