Using a diffusion wavelet neural network for short-term time series learning in the wafer level chip scale package process.
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| Title: | Using a diffusion wavelet neural network for short-term time series learning in the wafer level chip scale package process. |
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| Authors: | Li, Der-Chiang1, lidc@mail.ncku.edu.tw, Yeh, Chun-Wu2, davidyeh929@gmail.com, Chen, Chieh-Chih1, Shih, Hung-Ta1 |
| Source: | Journal of Intelligent Manufacturing; Dec2016, Vol. 27 Issue 6, p1261-1272, 12p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09565515 |
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| DOI: | 10.1007/s10845-014-0949-9 |
