Using a diffusion wavelet neural network for short-term time series learning in the wafer level chip scale package process.
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| Title: | Using a diffusion wavelet neural network for short-term time series learning in the wafer level chip scale package process. |
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| Authors: | Li, Der-Chiang1, lidc@mail.ncku.edu.tw, Yeh, Chun-Wu2, davidyeh929@gmail.com, Chen, Chieh-Chih1, Shih, Hung-Ta1 |
| Source: | Journal of Intelligent Manufacturing; Dec2016, Vol. 27 Issue 6, p1261-1272, 12p |
| Database: | Applied Science & Technology Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 119061594 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Using a diffusion wavelet neural network for short-term time series learning in the wafer level chip scale package process. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Li%2C+Der-Chiang%22">Li, Der-Chiang</searchLink><relatesTo>1</relatesTo>, <i>lidc@mail.ncku.edu.tw</i><br /><searchLink fieldCode="AU" term="%22Yeh%2C+Chun-Wu%22">Yeh, Chun-Wu</searchLink><relatesTo>2</relatesTo>, <i>davidyeh929@gmail.com</i><br /><searchLink fieldCode="AU" term="%22Chen%2C+Chieh-Chih%22">Chen, Chieh-Chih</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Shih%2C+Hung-Ta%22">Shih, Hung-Ta</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Intelligent+Manufacturing%22">Journal of Intelligent Manufacturing</searchLink>; Dec2016, Vol. 27 Issue 6, p1261-1272, 12p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=119061594 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10845-014-0949-9 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 12 StartPage: 1261 Titles: – TitleFull: Using a diffusion wavelet neural network for short-term time series learning in the wafer level chip scale package process. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Li, Der-Chiang – PersonEntity: Name: NameFull: Yeh, Chun-Wu – PersonEntity: Name: NameFull: Chen, Chieh-Chih – PersonEntity: Name: NameFull: Shih, Hung-Ta IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 12 Text: Dec2016 Type: published Y: 2016 Identifiers: – Type: issn-print Value: 09565515 Numbering: – Type: volume Value: 27 – Type: issue Value: 6 Titles: – TitleFull: Journal of Intelligent Manufacturing Type: main |
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