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Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices.

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Bibliographic Details
Title: Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices.
Authors: Carroll, Lee1, lee.carroll@tyndall.ie, Jun-Su Lee1, junsu.lee@tyndall.ie, Scarcella, Carmelo1, carmelo.scarcella@cern.ch, Gradkowski, Kamil1, kamil.gradkowski@tyndall.ie, Duperron, Matthieu1, matthieu.duperron@tyndall.ie, Huihui Lu1, huihui.lu@tyndall.ie, Yan Zhao1, yan.zhao@tyndall.ie, Eason, Cormac1, cormac.eason@tyndall.ie, Morrissey, Padraic1, padraic.morrissey@tyndall.ie, Rensing, Marc1, marc.rensing@tyndall.ie, Collins, Sean1, sean.collins@tyndall.ie, How Yuan Hwang1, howyuan.hwang@tyndall.ie, O'Brien, Peter1, peter.obrien@tyndall.ie
Source: Applied Sciences (2076-3417); Dec2016, Vol. 6 Issue 12, p426, 21p
Database: Applied Science & Technology Source
Description
ISSN:20763417
DOI:10.3390/app6120426