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Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices.

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Title: Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices.
Authors: Carroll, Lee1, lee.carroll@tyndall.ie, Jun-Su Lee1, junsu.lee@tyndall.ie, Scarcella, Carmelo1, carmelo.scarcella@cern.ch, Gradkowski, Kamil1, kamil.gradkowski@tyndall.ie, Duperron, Matthieu1, matthieu.duperron@tyndall.ie, Huihui Lu1, huihui.lu@tyndall.ie, Yan Zhao1, yan.zhao@tyndall.ie, Eason, Cormac1, cormac.eason@tyndall.ie, Morrissey, Padraic1, padraic.morrissey@tyndall.ie, Rensing, Marc1, marc.rensing@tyndall.ie, Collins, Sean1, sean.collins@tyndall.ie, How Yuan Hwang1, howyuan.hwang@tyndall.ie, O'Brien, Peter1, peter.obrien@tyndall.ie
Source: Applied Sciences (2076-3417); Dec2016, Vol. 6 Issue 12, p426, 21p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 120534876
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices.
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  Data: <searchLink fieldCode="JN" term="%22Applied+Sciences+%282076-3417%29%22">Applied Sciences (2076-3417)</searchLink>; Dec2016, Vol. 6 Issue 12, p426, 21p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=120534876
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