Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.
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| Title: | Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. |
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| Authors: | Magnien, J.1, julien.magnien@mcl.at, Mitterhuber, L.1, Rosc, J.1, Schrank, F.2, Hörth, S.3, Goullon, L.4, Hutter, M.4, Defregger, S.1, Kraker, E.1 |
| Source: | Microelectronics Reliability; Sep2017, Vol. 76, p601-605, 5p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00262714 |
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| DOI: | 10.1016/j.microrel.2017.07.052 |
