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Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.

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Bibliographic Details
Title: Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.
Authors: Magnien, J.1, julien.magnien@mcl.at, Mitterhuber, L.1, Rosc, J.1, Schrank, F.2, Hörth, S.3, Goullon, L.4, Hutter, M.4, Defregger, S.1, Kraker, E.1
Source: Microelectronics Reliability; Sep2017, Vol. 76, p601-605, 5p
Database: Applied Science & Technology Source
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