Investigation on the effects of low-temperature anodic bonding and its reliability for MEMS packaging using destructive and non-destructive techniques.
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| Title: | Investigation on the effects of low-temperature anodic bonding and its reliability for MEMS packaging using destructive and non-destructive techniques. |
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| Authors: | Joyce, Robin1,2, robin_nano@yahoo.co.in, George, Minu3, Bhanuprakash, Lokasani1, Panwar, Deepak Kumar2, Bhatia, Ravi Raj2, Varghese, Soney1, Akhtar, Jamil2 |
| Source: | Journal of Materials Science: Materials in Electronics; Jan2018, Vol. 29 Issue 1, p217-231, 15p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-017-7908-0 |
