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Investigation on the effects of low-temperature anodic bonding and its reliability for MEMS packaging using destructive and non-destructive techniques.

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Title: Investigation on the effects of low-temperature anodic bonding and its reliability for MEMS packaging using destructive and non-destructive techniques.
Authors: Joyce, Robin1,2, robin_nano@yahoo.co.in, George, Minu3, Bhanuprakash, Lokasani1, Panwar, Deepak Kumar2, Bhatia, Ravi Raj2, Varghese, Soney1, Akhtar, Jamil2
Source: Journal of Materials Science: Materials in Electronics; Jan2018, Vol. 29 Issue 1, p217-231, 15p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 127089833
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Investigation on the effects of low-temperature anodic bonding and its reliability for MEMS packaging using destructive and non-destructive techniques.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jan2018, Vol. 29 Issue 1, p217-231, 15p
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-017-7908-0
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 15
        StartPage: 217
    Titles:
      – TitleFull: Investigation on the effects of low-temperature anodic bonding and its reliability for MEMS packaging using destructive and non-destructive techniques.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Joyce, Robin
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            NameFull: George, Minu
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            NameFull: Bhanuprakash, Lokasani
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            NameFull: Panwar, Deepak Kumar
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            NameFull: Bhatia, Ravi Raj
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            NameFull: Varghese, Soney
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            NameFull: Akhtar, Jamil
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            – D: 01
              M: 01
              Text: Jan2018
              Type: published
              Y: 2018
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              Value: 29
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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